JPS6246272Y2 - - Google Patents
Info
- Publication number
- JPS6246272Y2 JPS6246272Y2 JP8774582U JP8774582U JPS6246272Y2 JP S6246272 Y2 JPS6246272 Y2 JP S6246272Y2 JP 8774582 U JP8774582 U JP 8774582U JP 8774582 U JP8774582 U JP 8774582U JP S6246272 Y2 JPS6246272 Y2 JP S6246272Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- frame
- metal heat
- semiconductor device
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8774582U JPS58189543U (ja) | 1982-06-12 | 1982-06-12 | モ−ルド型半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8774582U JPS58189543U (ja) | 1982-06-12 | 1982-06-12 | モ−ルド型半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58189543U JPS58189543U (ja) | 1983-12-16 |
| JPS6246272Y2 true JPS6246272Y2 (en]) | 1987-12-12 |
Family
ID=30096444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8774582U Granted JPS58189543U (ja) | 1982-06-12 | 1982-06-12 | モ−ルド型半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58189543U (en]) |
-
1982
- 1982-06-12 JP JP8774582U patent/JPS58189543U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58189543U (ja) | 1983-12-16 |
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